Articles Related to Circuits

Schneider Electric’s latest in its line of Masterpact circuit breakers looks nearly identical to its predecessors, but a closer look underneath the hood reveals...

IBM Corp. Tuesday rolled out a raft of new servers based on its Power5+ processors, including a new server with a Power5+ chip running at 2.2GHz and several new machines based on its quad-core module (QCM) technology that allows four Power5+ 1.5GHz cores to plug into a single socket.

Intel Corp. has discovered a flaw in its recently launched chipsets that can preclude a system from starting up normally, and is planning to recall a certain amount of those chipsets from system vendors and channel partners, a spokesperson confirmed Friday.

IBM Corp. has come up with a method of letting molecules assemble themselves inside chip structures to form nanoscale structures that add redundancy and performance improvements to chips, the company said.

French telecommunication and electronics manufacturer Alcatel SA is to cut a quarter of the 1,805 jobs at its optronics manufacturing division by the end of the year, resulting in the closure of factories in France and Canada.

French telecommunication and electronics manufacturer Alcatel SA is to cut a quarter of the 1,805 jobs at its optronics manufacturing division by the end of the year, resulting in the closure of factories in France and Canada.

With data traffic now surpassing voice traffic on the global public network, a new group of carrier-grade technologies has begun to emerge. One promising technology is Resilient Packet Ring.

Samsung Electronics Co. Ltd. has developed and is about to begin mass production of a new memory chip for mobile telephones that is about 30 per cent smaller in physical size than existing chips. The new low-power, 8Mb static random access memory (SRAM) chip is produced using a 0.13-micron process that is one generation more advanced than the 0.15-micron process used to manufacture most current mobile phone memory chips. A micron is one-thousandth of a millimetre, and the process figure refers to the smallest gap that can be created between circuits on the surface of the chip. With each advance in technology, chips can be made physically smaller and with improved performance. Sample production of the chip, which was developed earlier this year, has just begun and mass production is scheduled for the fourth quarter of this year, Samsung said.