Tundra Semiconductor Corp. announced Thursday an extension to a previously reported technology collaboration with IBM Corp. to launch its new Power Architecture solutions.
The Ottawa, Ont.-based vendor signed a license agreement with IBM for a 65nm Power processor core, which will be the processing engine of future System Interconnect products.
Previously, the two companies collaborated on a 90nm Power processor core, the first product in Tundra’s System Interconnect strategy.
IBM’s core architecture and I/O management experience will help Tundra target new and larger markets with its System Interconnect products, the company said.
